2020.10.29 01:00 UTC



$54 Xiaomi Mijia Paipai wireless HDMI system connects your computer to your TV

2020-10-29 05:29 CNXSoft Jean-Luc Aufranc (CNXSoft)

A few years ago, we covered plenty of cheap Miracast adapters that plugged into your...


Conflicting Messaging

2020-10-29 02:02 ElectronicsWeekly David Manners

Is it just me or do other people find it irritating that we get such confused covid messages from people in government positions? No sooner do we get reports that vaccines are doing everything that can be expected of them, that people are being trained up to deliver them, that they could be deployed by ...

This story continues at Conflicting Messaging

Or just read more coverage at Electronics Weekly


Customizable Apollo Lake mini-PC runs Linux

2020-10-28 21:27 LinuxGizmos Eric Brown

ADL’s Linux-ready “ADLEPC-1700” industrial mini-PC offers an Apollo Lake SoC, 8GB soldered LPDDR4, SATA, 2x GbE, 2x USB 3.0, DP, mini-PCIe, and a customizable I/O that defaults to 2x COM. ADL Embedded Solutions has announced an Intel Apollo Lake based ADLEPC-1700 successor to its Intel Bay Trail ADLEPC-1500 from 2017. The system has the same […]


Imaging radar development platform offers 2K resolution

2020-10-28 21:11 Embedded.com Nitin Dahad

Arbe, a developer of 4D imaging radar chipsets, has announced the rollout of a 2K resolution imaging radar development platform. This is targeted at tier 1s, original equipment manufacturers (OEMs), and new mobility players to enhance their perception algorithms.

The company said it is currently collaborating with over 20 tier-1 and OEM customers in the United States, Europe, China, Korea and Japan that are developing their next-generation radar systems based on this new platform. It expects Arbe technology-based radars to be implemented in vehicles on the road as early as 2022.

Arbe A Sample_sAccording to Arbe, current radars on the market process 12 channels, and industry radars in development are promising 192 channels. His compares with Arbe’s chipset which currently processes 2304 (48×48) channels, providing 2K ultra-high resolution, far beyond what any other radar can provide. Imaging radar with higher resolutions such as this one, combined with object detection in all environment conditions can help prevent the causes of some ADAS related road accidents, as it is better at being able to identify and track vulnerable road users such as pedestrians, bicycles, scooters, and can detect stationary objects like a parked vehicle in a lane, or road construction on the highway. It also eliminates false alarms, that are common with current generation radars, so that ADAS and AV systems can finally trust the reading from the radar.

The CEO of Arbe, Kobi Marenko, said, “Until now, our solution demonstrated tremendous potential to the industry promising both the highest standards of safety for ADAS and unmatched levels of perception for autonomous vehicles. With the launch of our radar development platform, our solution is now a reality for the road – moving from a theory to an actuality that is being implemented by customers across the globe. Meeting this milestone puts Arbe ahead of the automotive radar industry.”

Additionally, the development platform for 4D imaging radar serves as a base for advanced perception capabilities including accurate real time inference of the vehicle’s ego-velocity and in lane localization. Post processing the radar data allows tracking and classifying objects in the entire field of view of the vehicle and determines their orientation and motion vector, as well as provides precise and accurate free space mapping to distinguish drivable from non-drivable environments in any weather or lighting condition.

Arbe’s imaging radar development platform includes the entire Arbe imaging radar chipset with RF transmitter and receiver chips of 2K channels (48 receiving by 48 transmitting channels). This includes the patented imaging radar processor capable of processing 30Gbps of radar data. The chipset provides ultra-high resolution and supports over 100,000 detections per frame.

Through enhanced FMCW (frequency-modulated continuous-wave) technology, Arbe’s chipset technology transmits and receives signals from multiple antennas. By converting information from time to frequency domains (FFT), Arbe said it provides a 4D image with unparalleled element density in high azimuth and elevation resolution while simultaneously sensing the environment in long range with a wide field of view in real time. The technology also reduces sidelobe occurrence levels close to zero, resolving range-doppler ambiguities and avoiding interference from other radars.

The company has developed its own proprietary mmWave automotive grade radar RFIC chipset that includes a transmitter chip with 24 output channels and a receiver chip with 12 input channels. Using the FDSOI CMOS process 22FDX, Arbe’s RF chipset is designed to support TD-MIMO and has “best-in-class” performance for channel isolation, noise figure, and transmit power.

Arbe said its platform has a radar antenna with the densest channel array in the industry, delivering a form factor designed to perfectly fit automakers’ current sizing and vehicle mounting specifications. The platform also includes a software layer that abstracts the hardware access and scheduling; and a reference design to guide tier-1 and OEM customers’ radar system development.

Related Contents:

For more embedded, subscribe to embedded’s weekly email newsletter.

The post Imaging radar development platform offers 2K resolution appeared first on Embedded.com.


ST sets up lab-in-a-fab for piezo MEMS

2020-10-28 17:59 ElectronicsWeekly Steve Bush

STMicroelectronics is setting up a 200mm piezoelectric MEMS research facility inside its existing semiconductor fab in Singapore, in conjunction with the Singapore research institute A*STAR’s IME and Japanese manufacturing-tool vendor ULVAC. The three companies have a history of working together. “This collaboration will accelerate the adoption of piezo MEMS actuators in new fields of application ...

This story continues at ST sets up lab-in-a-fab for piezo MEMS

Or just read more coverage at Electronics Weekly


Xavier NX driven AI box has five GbE ports

2020-10-28 17:46 LinuxGizmos Eric Brown

Aaeon’s -10 to 60°C tolerant “Boxer-8250AI” AI edge computer runs Linux on a Jetson Xavier NX along with 5x GbE ports for IP cameras plus 4x USB 3.0, 2x COM, and an HDMI port. Aaeon has launched a $1,116 computer for embedded AI processing that combines the Nvidia Jetson Xavier NX module of its more […]


Dialog gets auto qual for haptics driver

2020-10-28 17:45 ElectronicsWeekly David Manners

Dialog has received automotive qualification for its DA7280 high-definition haptics driver. As a result, Alps Alpine has chosen the DA7280 to be used in conjunction with the Alps Alpine Heavy, the latest in the company’s family of HAPTIC Reactor linear resonant actuators (LRAs), to fuel intuitive interactive experiences in automotive applications. Dialog claims that the ...

This story continues at Dialog gets auto qual for haptics driver

Or just read more coverage at Electronics Weekly


Raspberry Pi based audio streamer features 5-inch touchscreen

2020-10-28 16:53 LinuxGizmos Eric Brown

Orchard Audio has launched an $800 “PecanPi Streamer Ultra” that adds a 5-inch touchscreen to the Raspberry Pi 3-based audio streamer. Orchard is also prepping a “PecanPi USB/SPDIF” DAC and amp that overrides your computer or phone audio. Last year, Orchard Audio found success with a well-reviewed PecanPi DAC Raspberry Pi add-on and PecanPi Streamer […]


Whitepaper: ON-Semi USB-C Programmable Power Supplies Satisfy 5G Smartphone Fast Charging Demands

2020-10-28 16:35 ElectronicsWeekly Alun Williams

Check out this whitepaper how ON-Semi USB-C Programmable power supplies can tackle 5G smartphone fast charging demands. With the emergence of 5G technology, the telecommunications industry is taking significant strides in advancing wireless architectures. Despite the ever increasing capacity of Li-ion batteries, the rate of charging for these larger batteries is still improving. Read this ...

This story continues at Whitepaper: ON-Semi USB-C Programmable Power Supplies Satisfy 5G Smartphone Fast Charging Demands

Or just read more coverage at Electronics Weekly


Coveting The Gold Mine

2020-10-28 15:00 ElectronicsWeekly David Manners

AMD and Nvidia have a lot in common. Both companies have seen their shares soar this year – AMD’s by nearly 80% and Nvidia’s by nearly 130% – giving them the $75 billion to make their acquisitions of Arm and Xilinx. And both companies’ share prices soared because Intel has been struggling, and Intel commands ...

This story continues at Coveting The Gold Mine

Or just read more coverage at Electronics Weekly


Silicon MEMS resonators

2020-10-28 14:00 ElectronicsWeekly David Manners

SiTime continues to siliconise the $7.7 billion timing market with ApexMEMS resonators. The devices represent SiTime’s third-generation of all-silicon MEMS technology and operate at popular MHz frequencies. ApexMEMS resonators are suited for high volume, space-constrained Mobile and IoT applications such as Bluetooth modules, hearables, high-speed connectivity interfaces, asset-tracking, and microcontrollers. “With our recent Cascade family of MEMS ...

This story continues at Silicon MEMS resonators

Or just read more coverage at Electronics Weekly


Cutting the complexity of wireless connectivity, co-existence

2020-10-28 13:45 Embedded.com Nitin Dahad

For designers of wireless connectivity enabled products, there are so many different technologies that it can sometimes look like a complex maze to navigate. But there’s never just one technology that fits the need, as many products have to address co-existence of multiple connectivity technologies for them to work effectively in a given environment.

NXP Connects wireless connectivity panel
Panelists for the discussion on cutting the complexity of wireless connectivity. For an excerpt scroll down this article to view video, or click here to go directly to the full video.

“Cutting the complexity of wireless connectivity” was the topic of a recent panel at the NXP Connects conference, where we moderated a panel discussion between Google, HID Global, Samsung and NXP. From Bluetooth to Wi-Fi 6 and 5G, as well as the emergence of ultra-wideband (UWB) technology, we asked the panel “How do you determine which technologies to work with? How do you develop wireless products and solutions that exploit the best of multiple protocols, and ensure co-existence?”

It’s a big question, especially as you have many technologies to contend with, such as Wi-Fi, Bluetooth, NFC, ZigBee, GNSS, LTE CAT-M1, NB-IoT, LoRa, SigFox. According to a recent report from ResearchandMarkets, the global wireless connectivity market covering these technologies is estimated to grow from US$ 69.0 billion in 2020 to US$ 141.1 billion by 2025, at a CAGR of 15.4%.

The major factors driving this industry growth are increased demand for wireless sensor networks in the development of smart infrastructure, a significant increase in the internet penetration rate, growth in adoption of the internet of things (IoT), increasing trends like work from home and virtual learning pertaining to the Covid-19 pandemic, and increased demand for low-power wide-area (LPWA) networks in IoT applications. High power consumption by wireless sensors, terminals and connected devices, and lack of uniform communication standards act as restraints for the wireless connectivity market.

According to the report, building automation end-use has the second-largest share of the wireless connectivity market in 2020, as a result of increasing demand for energy-efficient solutions, enhanced security, and constant need for improving living standards. Building automation, which started with wired technology, has now entered the era of wireless technology with technologies such as ZigBee, Z-wave, EnOcean, Wi-Fi, and Bluetooth Smart. Growing awareness of energy conservation, stringent legislation and building directives, promotion of numerous smart grid technologies, and availability of a number of open protocols are further driving growth in this segment.

LPWAN enabled chipsets projected to be fastest growing
Low-power wide-area networks use both licensed and unlicensed spectrums. SigFox and LoRa are the most widely used LPWAN technologies in an unlicensed spectrum, while NB-IoT and LTE Cat-M1 are the two most widely used technologies in a licensed spectrum. The extremely low power consumption and the ability of non-line-of-sight communication make LPWAN technologies ideal for industrial IoT applications.

LoRa technology is developed and promoted by the LoRa Alliance. The alliance is an open, non-profit association that was initiated by various companies to standardize LPWAN technologies. The founding members of the LoRa Alliance include Actility (France), Cisco (US), IBM (US), Semtech (US), and other leading telecom operators. LoRa is a chirp-based, spread-spectrum technology that uses a wider bandwidth and takes a broader spectrum compared to SigFox. Thus, it is more suitable for applications that demand higher bandwidths.

Wi-Fi enabled chipsets lead market volume in 2020
Wi-Fi has remained one of the most dominant wireless connectivity technologies in consumer electronics and enterprise applications. The demand for Wi-Fi-enabled connected home devices such as video doorbells, thermostats, lighting solutions, smart TVs, refrigerators, washing machines, and music systems is increasing. The changing lifestyles (connected living) of consumers is increasing the need to stay connected everywhere and all the time. The use of Wi-Fi in consumer electronics has enabled users to control the devices. Wi-Fi has revolutionized the way in which the user interacts with these devices. All these factors are supporting the growth of the market for chipsets based on Wi-Fi technology.

The increase in the adoption of smartphones in the middle-class population in emerging economies, such as India, Indonesia, and other Southeast Asian countries, is boosting the growth of the market for connected devices based on Wi-Fi technology.

How to cut the complexity of wireless connectivity

Click play to view an excerpt of the panel discussion on cutting the complexity of wireless connectivity

As mentioned earlier in this article, this was the question posed to the panel at NXP Connects. The panelists were:

  • Boon Loong Ng, research director at Samsung Research America’s standards and mobility innovation lab
  • Sanjay Noronha, product lead for wireless and networking for Google Nest’s Wi-Fi team
  • Ramesh Songukrishnasamy, senior vice president and CTO at HID Global
  • Rafael Sotomayor, executive vice president and general manager for security and connectivity at NXP

During the panel, we asked for their insights on some of the decision-making needed, use cases and trends or what they think is really hot right now.

Boon Loong Ng commented, “We believe UWB has immense potential, because of its ability to provide spatial awareness and directional sensing capabilities to smart devices. Of course, there are quite a number of wireless connectivity technologies on the phone, because they complement each other based on the applications and use cases.”

“A technology can be particularly suited for a certain function. But it is very common now for multiple technologies working in conjunction to bring the best user experience. For example, Bluetooth is suitable for supporting always-on device discovery due to its low power consumption. After discovery, UWB’s spatial sensing with more accurate range and directional finding can kick in. Wi-Fi and 5G will continue to play the role of enabling high throughput applications.”

“With regards to our long-term vision, enabling UWB for device-to-device applications like what we have introduced for Nearby Share and SmartThings Find are only the beginning. We expect to see more and more use cases and applications that we could only imagine in the past actually becoming realities with UWB.”

Ramesh Songukrishnasamy said, “With a broad portfolio of products and solutions in HID, through which we power trusted identities of the world’s people, places, and things, there are many new technologies that we are quite excited about. If I have to pick one that is of more relevant for this forum, I would pick Ultra-Wideband, UWB. UWB enables higher levels of accuracy in positioning capabilities along with increased data security compared to other RF technologies. UWB is also immune to RF interference, so it functions in high traffic settings. These capabilities will enable seamless user experience in a variety of use cases like hands-free access control in your workplace, hospitals, hotels, and homes.”

Because of its fine ranging capability, we believe it will enable many new location-based services and device-to-device IoT applications both in consumer products and industrial setup. As ASSA ABLOY and HID Global are the global leaders in secure access and identity solution, we are quite excited about the potential of UWB technology in managing access to physical and digital places, things, and identities.”

Sanjay Noronha added a different perspective, especially in the context of the smart home. He said, “It’s interesting people talk about the ‘smart home’. We prefer to think of our mission as how can we help users, and how can the home be helpful to them. We’re trying to deliver a strong portfolio of devices and services towards these goals of creating a helpful home. To do that we want to get technologies to work better together.”

“Of course, we have to address the fundamentals. You must start with a whole home robust Wi-Fi network. That’s realizable through a really simple mesh system these days. Then you have to look at low power technologies like 15.4, BLE, because this awareness comes from sensors and other battery-operated devices where power consumption is critical, and we know we can’t deliver that through Wi-Fi.”

“Once we tie all these things together, the experiences are delivered by the software that tie all these technologies together. Our point of view is if we do our job right, users should not even have to think about what the technology is. They should just be delighted by how easy it was to set up, how convenient it was to interact with the home and get the information that they need. This information should be delivered exactly when it needs to be, and where it needs to be.”

“At Google, we start with the user journey: what is it the users are trying to do, what is it they are trying to understand about their home, and what can their home do for them. And then we develop the architectures, the layers and the technologies which we work with our partners such as NXP to pull these things together. When we see that our technology doesn’t yet exist, then we try to invent it or adopt it. We can see evidence of this through our ecosystem of partners.”

Meanwhile, Rafael Sotomayor, said, “In today’s home it is not surprising to see 20 or more connected devices, and we know this number will grow exponentially in the next few years. I’m talking about things like door locks, lights, kitchen appliances. And if you go into industrial, that list is even longer. Each of them has different requirements, cost points, form factors, and so on. There’s not necessarily a one-size-fits-all, in terms of technology. And there’s unlikely to be a winner takes all scenario. It is a fragmented market, and very likely will remain fragmented.”

“In order to meet the challenge, a technology vendor like us must offer a comprehensive portfolio of connectivity technology options. We must simplify software – software is key. These are open ecosystems, companies’ products must interact with one another. So, minimizing the software burden through good SDK’s, reference applications, pre-integration is fundamental.”

“The same goes for simplifying hardware complexity. To support multiple technologies, multiple antennas, different power profiles, different PCB footprint requirements, we have to deliver co-existence techniques that allow various technologies to operate seamlessly, reliably, predictably. Then we have to remember that some of these companies are not big, the companies addressing IoT and industrial, so we must offer support flexibility, we must offer technology accessibility. So it helps a great deal to be able to rely on technology suppliers like NXP that are able to address these challenges with end-to-end solutions.”

The full panel discussion can be viewed online.

The post Cutting the complexity of wireless connectivity, co-existence appeared first on Embedded.com.


3D printing on a whole new (small) level

2020-10-28 13:31 ElectronicsWeekly Steve Bush

Leiden University in The Netherlands has scaled the well-known #3Dbenchy 3d printing challenge down and printed it to measure 30μm from end to end. It was printed on a Photonic Professional GT from Nanoscribe, which uses an immersion lithography lens system to implement two-photon polymerisation. A mini Benchy was not the real aim of the Leiden ...

This story continues at 3D printing on a whole new (small) level

Or just read more coverage at Electronics Weekly


Wrist-wearable ref design measures blood oxygen, ECG, heart rate, temperature and activity

2020-10-28 13:00 ElectronicsWeekly Steve Bush

Maxim is measuring blood oxygen, ECG, heart rate, body temperature and activity data in its third generation of wearable health monitor reference design, this time entirely wrist-worn. Called Health Sensor Platform 3.0 (aka MAXREFDES104#), it comes in a ready-to-wear wrist form with algorithms to provide heart rate, heart-rate variability (HRV), respiration rate (RR), SpO2 , ...

This story continues at Wrist-wearable ref design measures blood oxygen, ECG, heart rate, temperature and activity

Or just read more coverage at Electronics Weekly


Global O-RAN plugfest

2020-10-28 11:30 ElectronicsWeekly David Manners

Viavi Solutions today announced the company successfully participated in a global O-RAN plugfest hosted by several Tier-1 communications service providers (CSPs) and the O-RAN ALLIANCE. The plugfest involved a series of on-site demonstrations in multiple countries, conducted in September and October 2020. VIAVI provided industry-leading 4G and 5G test and validation platforms to support the ...

This story continues at Global O-RAN plugfest

Or just read more coverage at Electronics Weekly


LoRaWAN TS1-1.0.4 Link Layer (L2) spec published

2020-10-28 10:52 ElectronicsWeekly David Manners

The LoRa Alliance has published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification. Thisc latest definition of the LoRaWAN standard includes all required implementation elements to facilitate LoRaWAN deployments globally. According to industry research firm IoT Analytics, LoRaWAN is the most adopted LPWAN technology to date, representing more than one third of all deployments globally. This market ...

This story continues at LoRaWAN TS1-1.0.4 Link Layer (L2) spec published

Or just read more coverage at Electronics Weekly


The quest for a blob-free WiFi & Bluetooth stack for BL602 WiSoC

2020-10-28 10:09 CNXSoft Jean-Luc Aufranc (CNXSoft)

I thought I was done writing about Bouffalo Lab BL602 WiFI & Bluetooth RISC-V SoC...


How to half the size of electrolytics in universal ac-dc PSUs

2020-10-28 09:00 ElectronicsWeekly Steve Bush

In a nice example of lateral thinking, Power Integrations has found a way to halve the space needed for electrolytic reservoir capacitors in universal mains ac-dc PSUs up to 65W. It relies on automatically switching a low-voltage capacitor in parallel with a high voltage capacitor, springing from the observation that, for the same amount of ...

This story continues at How to half the size of electrolytics in universal ac-dc PSUs

Or just read more coverage at Electronics Weekly


F(x)tec Pro1 X smartphone runs LineageOS or Ubuntu, features a sliding keyboard (Crowdfunding)

2020-10-28 08:51 CNXSoft Jean-Luc Aufranc (CNXSoft)

F(x)tec Pro1 Android smartphone was introduced last year with the main differentiating features being its...


Tech giants to defend section 230

2020-10-28 07:29 ElectronicsWeekly David Manners

Later today, the CEOs of Google, Facebook and Google will defend their immunity from legal liability for what their sites publish. The trio are up before the US Senate Commerce Committee. Section 230 of the US Communications Decency Act states: “No provider or user of an interactive computer service shall be treated as the ...

This story continues at Tech giants to defend section 230

Or just read more coverage at Electronics Weekly


DRAM ASP to fall for the rest of the year

2020-10-28 07:27 ElectronicsWeekly David Manners

DRAM price erosion is expected till the end of 2020, reports IC Insights. The price jump that typically coincides with the introduction of new smartphone models in 3Q and 4Q is not expected due to disrupted buying patterns and cautious discretionary spending. IC Insights’ October Update to The McClean Report showed that the ASP of ...

This story continues at DRAM ASP to fall for the rest of the year

Or just read more coverage at Electronics Weekly


Europe is moving towards the Moon

2020-10-28 07:19 ElectronicsWeekly Alun Williams

Nasa and the European Space Agency (ESA) have signed a Memorandum of Understanding to take Europe to the Moon. ESA Director General Jan Wörner and Nasa Administrator Jim Bridenstine have officially declared the European Space Agency’s involvement with Nasa’s Artemis programme, albeit remotely due to Covid-19 restrictions. It will include building the next-generation International Space ...

This story continues at Europe is moving towards the Moon

Or just read more coverage at Electronics Weekly


SSD module shipments grew 60% in 2019

2020-10-28 07:16 ElectronicsWeekly David Manners

Kingston, ADATA and Tigo took the top three slots in the 2019 rankings of SSD module makers, says TrendForce. The total worldwide shipments of branded SSDs bound for the channel (retail) market in 2019 reached 131 million units, showing an increase of almost 60% from 2018, according to TrendForce’s latest investigations. This result also indicated ...

This story continues at SSD module shipments grew 60% in 2019

Or just read more coverage at Electronics Weekly


Melexis launches a better motorcycle fuel pump controller

2020-10-28 07:10 ElectronicsWeekly David Manners

Melexis, the Belgian fabless auto IC specialist, has introduced the most powerful and cost-efficient version of its market-leading motorcycle fuel pump controller, helping manufacturers comply with tightening environmental regulation, including the BS-6 emission standards in India. The MLX80302 is a three-phase BLDC motor controller IC with a peak driving capability of 2.6 A. It is ...

This story continues at Melexis launches a better motorcycle fuel pump controller

Or just read more coverage at Electronics Weekly


ST claims first 64-zone ToF sensor

2020-10-28 07:06 ElectronicsWeekly David Manners

ST has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with what it claims to be the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene. The device comprises a 940nm Vertical Cavity Surface Emission Laser (VCSEL) light source, a ...

This story continues at ST claims first 64-zone ToF sensor

Or just read more coverage at Electronics Weekly


Testing PTFE Tube for 3D Printing

2020-10-28 05:34 CNXSoft Karl Johnson

Karl here. I’m back with a short article on some testing that I did on...


ESP32-S2 board targets battery-powered applications with 30uA deep sleep power consumption

2020-10-28 04:43 CNXSoft Jean-Luc Aufranc (CNXSoft)

A few months ago, Olimex unveiled renders of ESP32-S2-Devkit-LiPo WiFi board that was supposed to...


Top Ten Foundries

2020-10-28 02:15 ElectronicsWeekly David Manners

Thanks to TrendForce for this ine – the top ten foundries in Q3:

This story continues at Top Ten Foundries

Or just read more coverage at Electronics Weekly


Optimizing high precision tilt/angle sensing: Accelerometer fundamentals

2020-10-27 22:33 Embedded.com Paul Perrault and Mahdi Sadeghi

Accelerometers are marvelous sensors that enable the sensing of static and dynamic accelerations as varied as the orientation with respect to gravity to the subtle motions of bridges beginning to fail. These sensors range from cell phone-grade devices that change the orientation of your display when you tilt them to export-controlled, tactical-grade devices that help to navigate military vehicles or spacecraft.[1] However, as with most sensors, it’s one thing for the sensor to perform well in the lab or benchtop. It’s quite another to get that performance at the system level in the face of environmental and temperature stresses that are wild and uncontrolled. When accelerometers, like humans, experience unprecedented stress in their lifetime, the system may react and fail due to effects from these stresses.

High accuracy tilt sensing systems are generally calibrated to achieve tilt accuracies better than 1°. Utilizing market-leading ultralow noise and highly stable accelerometers, such as the ADXL354 or ADXL355, one can achieve tilt accuracy of 0.005° with proper calibration of observable error sources.[2] However, this level of accuracy can only be achieved if stresses are properly mitigated. For instance, compressive/tensile stresses on the sensor can cause offsets as large as 20 mg, and thus tilt inaccuracies over 1°.

This article series reviews the performance metrics of a high precision angle/tilt sensing system using accelerometers. We’ll start in this article with an understanding of the sensor design itself at the microscopic level in order to better understand the effects of stresses and strains down to the micron level. In a separate article, we’ll then cover some surprising results that can happen if a holistic mechanical and physical design approach is not followed. Finally, we’ll close this series with tangible steps designers can take to maximize performance in the most demanding applications.

Fundamentals of Sensor Design

MEMS-based accelerometers can run the gamut in price and performance from consumer products to military sensing. Today, the best performing low noise accelerometers enable applications like precision tilt sensing, seismic imaging, and many emerging applications in robotics and platform stabilization. Important capabilities for high precision tilt/angle sensing applications include excellent noise, offset, repeatability, and temperature-related offsets, as well as second-order effects like vibration rectification and cross-axis sensitivity.

To better understand the design considerations for a 3-axis high precision MEMS accelerometer to perform optimally, it is educative to first review the internal structure of such a sensor, which will clarify the reason the three axes produce different responses to environmental parameters (for example, out-of-plane stress). In many cases, this out-of-plane stress is caused by a temperature gradient across the z-axis of the sensor.

The accelerometer shown in Figure 1 consists of a spring mass system, similar to many other MEMS accelerometers. The mass moves in response to an external acceleration (static acceleration like gravity or dynamic acceleration like velocity changes) and its physical displacement is sensed by a transduction mechanism.

click for full size image

Figure 1. Sensor architecture of a 3-axis high precision MEMS accelerometer, specifically the ADXL355 from Analog Devices. For the X/Y sensor, as the proof mass moves, the capacitance between the anchored fingers and the fingers attached to the proof mass changes. The imbalance of mass on the z-axis sensor allows for out-of-plane sensing of z-axis acceleration. (Source: Analog Devices)

The most common transduction mechanisms in MEMS sensors are capacitive, piezoresistive, piezoelectric, or magnetic. An accelerometer like the ADXL355 utilizes a capacitive transduction mechanism, in that a movement is sensed by a change in capacitance that, through a readout circuit, is converted to voltage or current output. Although the ADXL355 utilizes the capacitive transduction mechanism for all three axes sensors on a silicon die, X/Y sensors and Z sensors have two fundamentally different capacitive sensing architectures. X/Y sensors are based on differential in-plane fingers, while a Z sensor is an out-of-plane, parallel plate capacitive sensor, as shown in Figure 1.

If there is either compressive or tensile stress on the sensor, the MEMS die warps. Since the proof mass is suspended over the substrate with springs, it does not warp in tandem with the substrate, and, therefore, there will be a change in the gap between the mass and the substrate. For X/Y sensors, the gap is not in the direction of capacitive sensitivity, as the in-plane displacement has the largest impact on the capacitance change for the fingers. This is due to the compensating effect of the fringe electric field. For the Z sensor, however, the gap between the substrate and the proof mass is indeed the sense gap. Therefore, it has direct impact on the Z sensor since it effectively changes the sensing gap for the Z sensor. Another exacerbating effect is that the Z sensor is located in the center of the die, where the warpage is maximized for any given stress on the die.

In addition to the physical stresses, temperature gradient across the z-axis sensor is common due to the heat transfer asymmetry in the z-axis in most applications. In a typical application, the sensor is soldered to a printed circuit board (PCB) and the entire system is within a package. The X and Y heat transfer is dominated by conduction through the solder joints in the perimeter of the package and to the PCB, which is symmetric. In z-direction, however, the heat transfer is through conduction at the bottom due to solder and convection on top of the die as heat moves through the air and out of the package. Due to this mismatch, there will be a residual differential temperature gradient across the z-axis. Just as with the physical compressive/tensile stress, this will yield an offset in the z-axis that is not induced by acceleration.

In the next article in this series, we review how to acquire a good starting dataset to establish baseline performance and validate what sort of noise levels to expect in subsequent data analyses.


^[1] Chris Murphy. “Choosing the Most Suitable MEMs Accelerometer for Your Application—Part 1.” Analog Dialogue, Vol. 51, No. 4, October 2017.

^[2] Chris Murphy. “Accelerometer Tilt Measure Over Temperature and in the Presence of Vibration.” Analog Dialogue, August 2017.

Paul Perrault is a senior staff field applications engineer based in Calgary, Canada. His experience over the last 17 years at Analog Devices varies from designing 100+ amp power supplies for CPUs to designing nA-level sensor nodes and all current levels in between. He holds a B.Sc. degree from the University of Saskatchewan and an M.Sc. degree from Portland State University, both in electrical engineering. In his spare time, he enjoys back-country skiing in hip-deep powder, rock climbing on Rockies’ limestone, scrambling and mountaineering in local hills, and spending time outdoors with his young family. He can be reached at paul.perrault@analog.com.
Mahdi Sadeghi is a MEMS product application engineer in the AIN Technology Group at Analog Devices. He received his Ph.D. in electrical engineering from the University of Michigan, Ann Arbor, in 2014. His Ph.D. thesis and work as a research fellow at the Engineering Research Center for Wireless Integrated Microsystems (ERC WIMS) focused on the development of sensing microsystems for unmanned air vehicles and autonomous mobile platforms. His experience includes microhydraulic sensors and actuators, microfluidic systems, inertial sensing system design for wearables, and sensing solutions for condition-based monitoring applications. He can be reached at mahdi.sadeghi@analog.com.

For more Embedded, subscribe to Embedded’s weekly email newsletter.

The post Optimizing high precision tilt/angle sensing: Accelerometer fundamentals appeared first on Embedded.com.


Privacy-focused smartphone runs LineageOS or Ubuntu Touch

2020-10-27 21:58 LinuxGizmos Eric Brown

F(x)tec has launched a second-gen “Pro1 X” smartphone that runs the privacy-oriented LineageOS or Ubuntu Touch on a Snapdragon 835. The 6-inch screen slides up to reveal a keyboard. UK-based F(x)tec has joined with the XDA community to launch a reboot of its Pro1 phone on Indiegogo, this time replacing the mostly stock Android stack […]


Selecting an external power supply

2020-10-27 21:27 Embedded.com Ron Stull

Choosing an AC/DC power supply can be a daunting task. Should it be internal or external? Will it be compliant if my product ships to other regions of the world? Does my medical product need a power supply that conforms to medical safety standards? These are just some of the questions that engineers might ask as they focus their efforts on the power supply aspects of their new product design.

Determining The Type Of Power Supply Required

The decision to select an AC/DC external power supply may be down to practical space constraints within the product. Depending on the power requirements, internal power supplies can occupy valuable space, making the end-product unnecessarily larger than it needs to compared to other designs on the market. The footprint a product occupies is a crucial consideration for many consumers, especially when it might be on a counter-top or alongside a media system. Selecting an external supply, whether a desktop power supply or a wall plug unit (Figure 1), can be a prudent choice for some practical reasons as it keeps the end-product as small as possible.

Figure 1: CUI’s SWI product family offers a compact, efficient and economical solution for ac-dc wall adapters (Source CUI)

Wall plug units tend to suit products that need a DC supply from just a few watts up to approximately 50 Watts. Anything more than this will require a desktop unit (Figure 2).

Figure 2: The SDI160G-U and SDI160G-UD offer 160 Watts of continuous power and comply with UL/EN/IEC 62368-1 requirements (Source CUI)

For convenience, many designers opt to power their product from a standard 5 VDC supply, so selecting a wall plug unit that has a standard USB-A socket makes a simple choice for products drawing up to 2 Amps. Likewise, designing your product to work off the popular nominal voltages of 12 VDC, 15 VDC, or 24 VDC makes for ease of selection since most manufacturers provide standard units for these voltages. Also, what type of power input socket do you intend to use in your product? Is it available as standard or at an additional cost from the power supply manufacturer? Don’t forget to check the peak power requirements of your design, since that will determine the adapter you need to choose. Opting to use a unit that doesn’t offer enough peak output power, particularly those that have an inductive load such as a motor might result in overheating of the power supply, causing unnecessary component stress and lowering product reliability.

Compare Your Requirements Against the Datasheet Specifications

Make sure to study the datasheets of potential power supplies carefully, since some factors might not be so apparent as the output voltage and current rating.

Many wall plug power supplies provide a DC output that is floating with respect to ground. Termed Class II, these supplies do not provide access to a protective ground connection, you’ll need a Class I supply for that, and these tend to be desktop units.

Other specifications to check on the datasheet include line regulation, ripple and noise, protection features, and approvals.

Regulation gives a measure of how close a power supply can maintain its output voltage against the stated nominal output. Adequate regulation may be +/- 10 %, but if your application is sensitive to voltage input changes, this feature needs further consideration. For a nominal 12 VDC output, a +/- 10 % regulation means the output voltage could range from 10.8 VDC to 13.2 VDC. Ripple and noise will usually be present on the DC output, and again, sensitive embedded circuitry may be prone to excessive noise on the power lines. The use of additional filtering components may assist but bear in mind that those will add to your bill of material cost and will occupy valuable PCB space.

While looking at the electrical specifications, check to see what types of protection features the power supply has as standard. Output over voltage, output over current, and over temperature are popular protections, but if your product may function erratically should the input voltage fall below a given voltage, an under voltage lock-out requirement may also be important.

Safety and Energy Efficiency Standards

Power supply approvals incorporate aspects of safety, energy efficiency, and electromagnetic compatibility. The following standards all apply to not only the power supply unit but also the product connected to it as a whole. Internal standard IEC-62368 stipulates safety factors such as the maximum permitted leakage currents and input to output isolation voltages for commercial, IT and AV equipment. Figure 3 illustrates the potential safety hazards and the isolation testing requirements. Isolation prevents the lethal AC line voltage being passed through to the DC output.

Figure 3: Isolation test requirements for an AC/DC power adapter (source CUI)

The IEC-62368 will become law in December 2020, having been determined previously by two standards IEC-60950 (IT systems) and IEC-60065 (AV equipment). This safety standard also stipulates the minimum distances relating to voltage stresses within the power supply specified in terms of creepage (the surface path between two points) and clearance (the direct air gap distance). Any power supply used for powering medical appliances that have potential to contact the patient, such as blood pressure monitors, diagnostic equipment, or oximeters needs to conform to IEC 60601-1 4th edition.

Energy efficiency is an essential aspect of any power supply. The European Ecodesign 2019/1782 and the US Department of Energy Level VI standards stipulate the minimum average active efficiency requirements; the average of the efficiency measured at 25%, 50%, 75%, and 100% load. Ecodesign further requires documentation of the efficiency at 10% of full load. See Figure 4 for the timeline evolution of energy efficiency standards. These also have specific limits on energy consumption when there is no load, or the end-product is in standby.

click for full size image

Figure 4: Energy efficiency standards timeline (Source CUI)

Energy efficiency has recently benefited from advances in semiconductor process technologies, with silicon carbide (SiC), and Gallium Nitride (GaN) proving to be well suited to power conversion applications.

The final aspect of approvals covers how susceptible a power supply may be to the effects of external electromagnetic inference and also if the power supply itself generates EMI above acceptable levels. The FCC Part 15 Class B, CISPR 32, and IEC 61204-3 standards apply.

The selection of an external power supply adapter need not be an erroneous task. A thorough review of the power supply requirements and a diligent comparison of datasheet features can simplify the project significantly.

Ron Stull is a Power Systems Engineer at CUI Inc. Ron has gathered a range of knowledge and experience in the areas of analog and digital power as well as ac-dc and dc-dc power conversion since joining CUI in 2009. He has played a key role on CUI’s Engineering team with responsibilities including application support, test and validation, and design. Outside of power engineering Ron can be found playing guitar, running, and touring the outdoors with his wife, where their goal is to visit all of the U.S. National Parks.

For more Embedded, subscribe to Embedded’s weekly email newsletter.

The post Selecting an external power supply appeared first on Embedded.com.


Verizon deploys Movandi 5G mmWave smart active repeater

2020-10-27 19:10 Embedded.com Nitin Dahad

Movandi has announced the deployment of a 5G extender indoor smart repeater built on its BeamXR mmWave technology, a smart active repeater solution that amplifies coverage and closes the gap in 5G mmWave deployments. It is designed to penetrate physical barriers in urban environments and amplify mmWave coverage in public spaces and inside buildings. Movandi has an exclusive partnership with Verizon to deploy its 5G solution to U.S. consumers.

The CEO and co-founder of Movandi, Maryam Rofougaran, said, “The future of 5G mmWave depends on the industry’s ability to make the most out of today’s new 5G infrastructure. Movandi’s BeamXR smart repeater is unmatched in the industry, by combining a fully integrated RF front-end and system-level design – deliver a complete long range and low power solution with unlimited mesh configurations that solve mmWave propagation, blocking, path loss and latency challenges. We are enabling the 5G future by helping Tier 1 operators and partners unleash the potential of 5G technology for billions of users around the world.”

The company’s BeamXR addresses the issue of 5G coverage limitations caused by the propagation characteristics of radio signals at millimeter wave frequency bands. Millimeter waves are unable to penetrate physical barriers, including buildings and trees. That makes it hard to provide effective indoor coverage as well. The inability to go through objects means 5G requires line-of-sight, or strong indirect beam. With the BeamXR active router, millimeter wave signals can be boosted to penetrate buildings or bend the signal around a building. It essentially distributes a 5G signal more effectively, enabling greater coverage while supporting low latency in hard-to-reach places.

Movandi line of sight penetration issues
5G requires line of sight or strong indirect beam. Movandi’s BeamXR active router boosts millimeter wave signals by penetrating buildings or bending the signal around a building. (Image: Movandi)

Speaking to EE Times earlier this year, Rofougaran said, “We are addressing the propagation challenge which helps accelerate large-scale 5G commercialization by reducing infrastructure costs, simplifying deployment and increasing network capacity without impacting latency.” She also said that sub-6GHz capacity will fail to meet customer demand by 2023, and with operators needing to go to millimeter wave to meet the capacity requirements, Movandi’s 5G enhancer will enable cost-effective capacity and coverage.

The senior vice president of consumer products at Verizon, Brian Higgins, said, “Verizon’s exclusive U.S. partnership with Movandi to deploy their first-to-market 5G repeater technology allows us to continue to provide the cutting-edge solutions and industry leadership that our customers have grown to expect.”

5G technology promises to eventually offer data rates that are 100 times faster than current 4G networks, and could enable new applications such as self-driving cars, smart buildings and smart cities, telemedicine, virtual and augmented reality (VR/AR), mobile cloud-based services, and an exponential increase in connected devices for the Internet of Things and industrial IoT (IIoT). Movandi has an exclusive partnership with Verizon to deploy its 5G solution to U.S. consumers.

Movandi 5G repeater
A 5G extender indoor smart repeater built on Movandi’s BeamXR mmWave technology (Image: Movandi)

The smart repeater connects to a 5G base station through beamforming, enabling customer premises equipment (CPE) and mobile devices to access the base station.

BeamXR smart repeaters are based on Movandi’s proven BeamX mmWave beamforming technology, introduced in 2018. The BeamX front-end integrates CMOS-based RF ICs, antenna, beamforming and advanced control algorithms into a modular 5G mmWave platform solution. BeamXR smart repeaters are more compact, more energy-efficient over a wider power range, more spectrally efficient, and more cost-effective to manufacture and deploy than alternative approaches. Movandi provides customers with complete reference designs and can work with manufacturers to ship products directly to customers.

The post Verizon deploys Movandi 5G mmWave smart active repeater appeared first on Embedded.com.


electronica 2020 embedded forum

2020-10-27 17:56 Embedded.com Nitin Dahad

With electronica being held virtually this year, the embedded forum running alongside it will also be virtual with a complete four-day program covering the various aspects of embedded systems design.

Over the four days, there will be sessions on tools and software, microcontrollers, internet of things (IoT) connectivity and security, and low power design.

  • Tools & Software (Mon, Nov 9)
  • Microcontrollers (Tue, Nov 10)
  • IoT, Connectivity, Security (Wed, Nov 11)
  • Low Power Design (Thu, Nov 12)

The schedule is available online, but here’s a flavor of what you’ll see.

What’s next in edge computing?
Flavio Bonomi, technical advisor at Lynx Software Technologies, will explore what’s next after edge computing. Edge computing is now in everything from manufacturing plants, smart cities to logistics’ hubs. The next wave on the horizon is the creation of “systems of systems” architectures with time sensitive networking connecting rich, highly consolidated processing resources.

This path provides an opportunity for processing to be applied on a more dynamic basis across these more fluid architectures. His presentation will look at why edge computing needs to evolve in this direction, citing specific use cases, and points to some early indications as to the types of platforms being deployed.

Automotive security: learning from the past, and what it means for the future
Christopher Tubbs, director business development EMEA at Green Hills Software, will explore the requirements for the highest levels of security in connected and autonomous vehicles. Our ability to develop robust systems that can ensure our safety and security will make the difference not only between the acceptance or rejection by the consumer, but the industry as a whole. This session looks at lessons from the past, examines what they can teach us and then applies them to the software challenges we are facing today.

Architectural exploration for AI and machine learning
A modem SoC project is a combination of hardware and processor resources with the software application that together provide an optimal solution for the targeted end market use case. The AI and machine learning algorithms have been developed and perfected in cloud-based platforms and training datasets base on significant real-world data. To further enhance the performance for applications in edge devices the use of dedicated hardware can be explored to fine tune the optimum configuration of many core processors.

Simon Davidmann, CEO at Imperas, will explore how RISC-V offers not just the flexibility to configure each node to match the performance requirements but can also support custom instructions and extensions. His talk with cover the migration of cloud-based algorithms to dedicated hardware acceleration with the design flexibility RISC-V now offers system designs for SoC, FPGA and chiplet designs.

This is just a sample of the many talks you’ll get to hear at the embedded forum. To view the full schedule and register for the embedded forum, click here.

The post electronica 2020 embedded forum appeared first on Embedded.com.


Five-port Arm networking SBC offers LVDS link

2020-10-27 17:04 LinuxGizmos Eric Brown

Forlinx has a new “OK1028A-C” networking board based on a “FET1028A-C” module that runs Linux on a dual -A72 NXP LS1028A. The SBC features 5x GbE ports with TSN plus an LVDS link for HMI. Last year, Forlinx launched the headless OK1043A-C and OK1046A networking SBCs, which run Linux on NXP’s quad-core, Cortex-A53 LS1043A and […]


First 64-zone direct time-of-flight module improves spatial scene detail

2020-10-27 16:08 Embedded.com Nitin Dahad

STMicroelectronics has extended its portfolio of FlightSense time-of-flight (ToF) sensors with what it claims is the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene.

The new VL53L5 comprises a 940nm vertical cavity surface emission laser (VCSEL) light source, a system-on-chip sensor integrating a VCSEL driver, the receiving array of single photon avalanche diodes (SPADs), and a low-power 32-bit MCU core and accelerator running sophisticated firmware. It retains the Class 1 certification of all ST’s FlightSense sensors and is fully eye-safe for consumer products. Housed in a miniature module, the sensor contains optical elements in the receive aperture that creates 64 ranging zones, unlocking a host of new features and use cases.

The general manager of ST’s imaging division, Eric Aussedat, said, “Delivering 64x more ranging zones than previously available, the VL53L5 offers radical performance improvement in laser autofocus, touch-to-focus, presence detection, and gesture interfaces while helping developers create even more innovative imaging applications. The multi-zone VL53L5 FlightSense direct time-of-flight sensor uses our most advanced 40nm SPAD production process to offer outstanding 4m ranging performance and up to 64 ranging zones that help an imaging system build a detailed spatial understanding of the scene.”

ST said with each new generation of its time-of-flight technology, it has added significant high-value performance improvements across a wide range of use cases including human-presence detection to control the wakeup and hibernation of laptops or monitors and laser autofocus in hybrid focusing algorithms for smartphone cameras. The autofocus feature of its FlightSense sensors is embedded in most of the highest-ranking smartphone cameras according to DXOMARK, an independent benchmark that assesses image quality.

The camera subsystem is a major factor in differentiating smartphone performance, and, within the camera, the laser autofocus assures quick, accurate focusing in low-light scenes or when capturing low-contrast targets. These scenarios present tough challenges for conventional autofocus systems. Widely adopted by leading smartphone OEMs, laser autofocus embedding ST’s FlightSense is now shipping in more than 150 phone models.

Packaged in a 6.4 x 3.0 x 1.5 mm module, the VL53L5 integrates both transmit and receive lenses into the module design and expands the field of view (FoV) of the module to 61-degrees diagonal. This wide FoV is especially suited to detect off-center objects and ensure perfect autofocus in the corners of the image. In the ‘laser autofocus’ use case, the VL53L5 gathers ranging data from up-to 64 zones across the full FoV to support “touch to focus” and many other features. This flexibility significantly enhances smartphone/camera performance, convenience, and versatility.

Further flexibility is available via the SPAD array, which can be set to favor spatial resolution, where it outputs all 64 zones at up to 15fps, or to favor maximum ranging distance, where the sensor outputs 4×4/16 zones at a frame rate of 60fps.

ST’s architecture can automatically calibrate each ranging zone and direct time-of-flight technology allows each zone to detect multiple targets and reject reflection from the cover-glass. In addition, the FlightSense approach gathers the raw data collected by the SPAD array and performs post processing, via a proprietary, embedded MCU and accelerator before transferring the ranging data to the system host over an I2C or a SPI bus. This removes the need for a specific camera interface and powerful receiver MCU and assures high-quality, high-performance operation.

With a vertically integrated manufacturing model for its FlightSense sensors, ST builds its SPAD wafers on a 40nm proprietary silicon process in the company’s state-of-the-art 12” wafer plant at Crolles, France before assembling all of the module components in ST’s back-end plants in Asia.

Customer development with the VL53L5 can build on ST’s relationships with key smartphone and PC platform suppliers as ST has pre-integrated the sensor onto these platforms. Android and Windows device drivers are also widely available for the FlightSense products. ST said the VL53L5 is in mass production with millions of units already shipped to leading wireless and computer manufacturers.

The post First 64-zone direct time-of-flight module improves spatial scene detail appeared first on Embedded.com.


‘The Largest IPO In Human History’

2020-10-27 15:21 ElectronicsWeekly David Manners

There still seems to be plenty of money around if you’re in the right business. The upcoming IPO of Ant Group, founded by Alibaba founder Jack Ma, has been priced at a level which will create 18 billionaires among employees and investors. Ma’s stake will be worth $27.4 billion which, added to the fortune he ...

This story continues at ‘The Largest IPO In Human History’

Or just read more coverage at Electronics Weekly


Oplà IoT Kit is Arduino’s first open programmable IoT platform

2020-10-27 14:42 CNXSoft Jean-Luc Aufranc (CNXSoft)

Arduino is well-known for its maker boards and shields that are sometimes sold as part...


AMD-Xilinx takeover confirmed

2020-10-27 14:38 ElectronicsWeekly David Manners

Today, AMD and Xilinx announced they have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion. The combination will offer a portfolio of processor technologies, combining CPUs, GPUs, FPGAs, Adaptive SoCs and software expertise to enable computing platforms for cloud, edge and end devices. The combined ...

This story continues at AMD-Xilinx takeover confirmed

Or just read more coverage at Electronics Weekly


Xilinx adds hardened IP to increase RFSoC performance for 5G

2020-10-27 14:01 ElectronicsWeekly Caroline Hayes

Xilinx has announced an enhanced Zynq RFSoC architecture to meet the requirements of a second wave of 5G. The ZynqRFSoC DFE integrates hardened digital front end application-specific blocks for 5G NR performance. It will operate up to 7.125GHz and is futureproofed for 3GPP and O-RAN radio architectures, says Gilles Garcia, director of Wired Communication, at ...

This story continues at Xilinx adds hardened IP to increase RFSoC performance for 5G

Or just read more coverage at Electronics Weekly


Maxim majors on industrial automation with new parts and designs

2020-10-27 14:00 ElectronicsWeekly Steve Bush

Maxim has announced a suite of integrated circuits and reference designs for industrial automation using IO-Link communications. IO-Link is a short-range (<20m) point-to-point industrial bus developed to connect sensors and actuators to a local hub, from which the data is transferred to a remote PLC (programmable logic controller) via Ethernet or other long-range field bus. ...

This story continues at Maxim majors on industrial automation with new parts and designs

Or just read more coverage at Electronics Weekly


MINISFORUM EliteMini H31G Coffee Lake Mini PC Review with Windows & Linux

2020-10-27 13:49 CNXSoft Ian W MORRISON (Linuxium)

MINISFORUM have launched their EliteMini H31G which combines a desktop CPU with a discrete graphics...


Touching the light, with the Electric Paint Lamp Kit

2020-10-27 13:43 ElectronicsWeekly Alun Williams

This one caught my eye - quite literally, due to the flashing light in the tweet. It's Bare Conductive's Electric Paint Lamp Kit for customising interactions with lamps.

This story continues at Touching the light, with the Electric Paint Lamp Kit

Or just read more coverage at Electronics Weekly


Toshiba CMOS op-amp draws only 0.27μA

2020-10-27 11:58 ElectronicsWeekly Steve Bush

Toshiba has released an micro-power CMOS operational amplifier, drawing a maximum of 600nA and typically 270nA (1.5V supply, -40 to 105°C). Called TC75S102F, it will run from supplies between 1.5V and 5.5V and is rail-to-rail on both input and output. Unusually for an op-amp, no input excursion outside the rails is allowed at all. “Operational amplifiers have ...

This story continues at Toshiba CMOS op-amp draws only 0.27μA

Or just read more coverage at Electronics Weekly


Renesas launches online marketplace

2020-10-27 11:24 ElectronicsWeekly David Manners

Today, Renesas launches its online Market Place, which offers a one-stop source of solutions that help accelerate technical innovation for the future mobility market. Developers can download various solutions designed for Renesas’ R-Car automotive system-on-chips (SoCs) directly from the Market Place. Developers can also use the Market Place as a portal to obtain reference evaluation ...

This story continues at Renesas launches online marketplace

Or just read more coverage at Electronics Weekly


Farnell signs MegiQ

2020-10-27 11:18 ElectronicsWeekly David Manners

Farnell has added RF and microwave development tools from MegiQ to its test and measurement portfolio. Farnell offers the full MegiQ range of Vector Network Analysers and Antenna Measurement Systems used by designers to develop, test and verify wireless communication equipment and IoT devices. MegiQ products are affordable to to IoT start-ups and universities looking ...

This story continues at Farnell signs MegiQ

Or just read more coverage at Electronics Weekly


Tek’s isolated scope probes get smaller, better

2020-10-27 11:01 ElectronicsWeekly Steve Bush

Tektronix has announced a second-generation of IsoVu isolated oscilloscope probes, claiming smaller size, easier use and enhanced electrical performance. Isolated probes are for probing power systems when high common-mode voltages and un-grounded systems make life difficult for differential probes. “Engineers working with wide-bandgap technologies such as SiC and GaN face difficult challenges to accurately measure and ...

This story continues at Tek’s isolated scope probes get smaller, better

Or just read more coverage at Electronics Weekly


Cincon half brick DC-DC converters have wide input range for rail and industry

2020-10-27 10:27 ElectronicsWeekly Staff

Specialist distributor, Relec Electronics, has added the CHB150W12 and CHB200W12, wide input DC-DC modules. The CHB150W12 (150W) and CHB200W12 (200W) half brick DC-DC converters have an ultra-wide, 12:1 universal input range of 14-160Vdc. They are rugged, making them practical for use in railway applications, distributed power architectures, telecommunications, battery operated equipment and industrial applications. Both ...

This story continues at Cincon half brick DC-DC converters have wide input range for rail and industry

Or just read more coverage at Electronics Weekly


Chuwi LarkBox Pro mini PC gets a faster Celeron J4125 processor, sells for $179

2020-10-27 08:33 CNXSoft Jean-Luc Aufranc (CNXSoft)

CHUWI Larkbox is a 2.4-inch mini PC that can fit in the palm of your...


China phone production down but computers up

2020-10-27 07:20 ElectronicsWeekly David Manners

Chinese production of mobile phones from will suffer a double-digit decline this year, says the National Bureau of Statistics of China. In 1Q 2020, China mobile phone production declined 50% from 4Q 2019 and dropped 33% from a year earlier. Many factories were temporarily closed. Production has since recovered with 2Q 2020 units up 36% ...

This story continues at China phone production down but computers up

Or just read more coverage at Electronics Weekly


RISC-V Conference Programme

2020-10-27 07:19 ElectronicsWeekly David Manners

The RISC-V International Association has announced the online program for the RISC-V Summit 2020 from Tuesday Dec. 8 to Thursday, Dec. 10, 2020. Register online here. The RISC-V Summit brings together innovators, academics and business leaders to discuss the latest developments in the RISC-V ecosystem and dive deeper into collaboration and commercialization opportunities. The virtual ...

This story continues at RISC-V Conference Programme

Or just read more coverage at Electronics Weekly